| { |
| "Header": { |
| "GenerationSoftware": { |
| "Vendor": "KiCad", |
| "Application": "Pcbnew", |
| "Version": "7.0.0" |
| }, |
| "CreationDate": "2023-06-21T13:32:25+02:00" |
| }, |
| "GeneralSpecs": { |
| "ProjectId": { |
| "Name": "hacklock-2137", |
| "GUID": "6861636b-6c6f-4636-9b2d-323133372e6b", |
| "Revision": "rev?" |
| }, |
| "Size": { |
| "X": 155.1, |
| "Y": 75.1 |
| }, |
| "LayerNumber": 2, |
| "BoardThickness": 1.6, |
| "Finish": "None" |
| }, |
| "DesignRules": [ |
| { |
| "Layers": "Outer", |
| "PadToPad": 0.2, |
| "PadToTrack": 0.2, |
| "TrackToTrack": 0.2, |
| "MinLineWidth": 0.2, |
| "TrackToRegion": 0.5, |
| "RegionToRegion": 0.5 |
| } |
| ], |
| "FilesAttributes": [ |
| { |
| "Path": "hacklock-2137-F_Cu.gbr", |
| "FileFunction": "Copper,L1,Top", |
| "FilePolarity": "Positive" |
| }, |
| { |
| "Path": "hacklock-2137-B_Cu.gbr", |
| "FileFunction": "Copper,L2,Bot", |
| "FilePolarity": "Positive" |
| }, |
| { |
| "Path": "hacklock-2137-F_Paste.gbr", |
| "FileFunction": "SolderPaste,Top", |
| "FilePolarity": "Positive" |
| }, |
| { |
| "Path": "hacklock-2137-B_Paste.gbr", |
| "FileFunction": "SolderPaste,Bot", |
| "FilePolarity": "Positive" |
| }, |
| { |
| "Path": "hacklock-2137-F_Silkscreen.gbr", |
| "FileFunction": "Legend,Top", |
| "FilePolarity": "Positive" |
| }, |
| { |
| "Path": "hacklock-2137-B_Silkscreen.gbr", |
| "FileFunction": "Legend,Bot", |
| "FilePolarity": "Positive" |
| }, |
| { |
| "Path": "hacklock-2137-F_Mask.gbr", |
| "FileFunction": "SolderMask,Top", |
| "FilePolarity": "Negative" |
| }, |
| { |
| "Path": "hacklock-2137-B_Mask.gbr", |
| "FileFunction": "SolderMask,Bot", |
| "FilePolarity": "Negative" |
| }, |
| { |
| "Path": "hacklock-2137-Edge_Cuts.gbr", |
| "FileFunction": "Profile", |
| "FilePolarity": "Positive" |
| } |
| ], |
| "MaterialStackup": [ |
| { |
| "Type": "Legend", |
| "Name": "Top Silk Screen" |
| }, |
| { |
| "Type": "SolderPaste", |
| "Name": "Top Solder Paste" |
| }, |
| { |
| "Type": "SolderMask", |
| "Thickness": 0.01, |
| "Name": "Top Solder Mask" |
| }, |
| { |
| "Type": "Copper", |
| "Thickness": 0.035, |
| "Name": "F.Cu" |
| }, |
| { |
| "Type": "Dielectric", |
| "Thickness": 1.51, |
| "Material": "FR4", |
| "Name": "F.Cu/B.Cu", |
| "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" |
| }, |
| { |
| "Type": "Copper", |
| "Thickness": 0.035, |
| "Name": "B.Cu" |
| }, |
| { |
| "Type": "SolderMask", |
| "Thickness": 0.01, |
| "Name": "Bottom Solder Mask" |
| }, |
| { |
| "Type": "SolderPaste", |
| "Name": "Bottom Solder Paste" |
| }, |
| { |
| "Type": "Legend", |
| "Name": "Bottom Silk Screen" |
| } |
| ] |
| } |